Tianjin Baienwei New Material Technology Co.,Ltd

Microelectronic Package Product Description Computer CPU,DSC chips Integrated Circuit Package Housings Carriers Radar Microwave modules Semiconductor Wafers Electronic Communications Devices Materials:Silicon Aluminum Alloys(AlSi Alloys) Configuration:Platforms,Plug-ins,Flatpacks,TO Headers etc. Advantages CTE match to circuit boards and components; High thermal conductivity and outstanding heat dissipation; Low density; Hermeticity; Dimensional stability; Corrosion Resistance; Wafer Level Packaging; Ease of manufacture. AlSi Alloys Performance Parameters Content Density g/cm³ CTE ppm/℃ Thermal Conductivity W/mK Tensile Strength MPa Yield Strength MPa Poisson's Ratio Elongation % Elastic Modulus GPa Al-27%Si 2.6 17 175 170 130 0.29 3.8 91 Al-42%Si 2.55 13.5 160 200 187 0.29 1 105 Al-50%Si 2.5 11.5 140 220 210 0.28 <1 108 Al-60%Si 2.46 10 125 210 210 0.27 <1 111 Al-70%Si 2.43 7.5 120 135 135 0.27 <1 114